Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2015 + A1:2017); German version EN 60068-2-58:2015 + A1:2018
Edition 2018-09

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2015 + A1:2017) (german version)
Edition 2018-10-01

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Edition 2015-05

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Edition 2015-05

Environmental testing - Part 2-58 : tests - Test Td : test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Edition 2015-08-08

Environmental testing - Part 2-58 : tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Edition 2018-04-13

Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Edition 2015-05-31

Iron ores for shaft direct-reduction feedstocks - Determination of the reducibility index, final degree of reduction and degree of metallization
Edition 2015-08

Semiconductor devices - Metallization stress void test (IEC 62418:2010); German version EN 62418:2010
Edition 2010-12