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IPC JEDEC 9707 AMD 1
Spherical Bend Test Method for Characterization of Board Level Interconnects
Edition
2018-05-01
IPC EIA/JEDEC J-STD-075A ; ECIA/IPC/JEDEC J-STD-075A:2018-05-01
Classification of Passive and Solid State Devices for Assembly Processes
Edition
2018-05-01
IPC EIA/JEDEC J-STD-002E ; IPC EIA/IPC/JEDEC J-STD-002E:2017-11-01
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
Edition
2017-11-01
IPC JEDEC 9704A
Printed Circuit Assembly Strain Gage Test Guideline
Edition
2012-02-03
IPC JEDEC J-STD-033D
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
Edition
2018-03-01
IPC JEDEC J-STD-020F
Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs)
Edition
2022-12-01
IPC JEDEC J-STD-035A
Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Devices
Edition
2022-12-01
IPC JEDEC J-STD-609C
Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly
Edition
2023-12-01
IPC JEDEC 9702
Monotonic Bend Characterization of Board-Level Interconnects
Edition
2015-05
IPC JEDEC 9301
Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability
Edition
2018-12
