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Standards [CURRENT]

DIN EN 16603-50-14

Space engineering - Spacecraft discrete interfaces; English version EN 16603-50-14:2014
Edition 2014-12

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
Edition 2017-11-01

Standards [CURRENT]

IPC EIA J-STD-026

Semiconductor Design Standard for Flip Chip Applications
Edition 1999-08-01

Standards [CURRENT]

IPC EIA J-STD-028

Performance Standard for Construction of Flip Chip and Chip Scale Bumps
Edition 1999-08

Standards [CURRENT]

IPC EIA J-STD-032

Performance Standard for Ball Grid Array Balls
Edition 2002-06-30

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
Edition 2013-08-12

Classification of Passive and Solid State Devices for Assembly Processes
Edition 2018-05-01

Technical rule [CURRENT]

VDI 3957 Blatt 21

Biological measuring techniques for the determination and evaluation of effects of air pollutants (biomonitoring) - Evaluation of phytotoxic effects of ambient air pollutants with lichen exposure of Hypogymnia physodes
Edition 2019-07

Standards [CURRENT]

CSA ISO/IEC 14165-151

Information technology - Fibre channel - Part 151: Fibre Channel BaseT (FC-BaseT) (Adopted ISO/IEC 14165-151:2017, first edition, 2017-11)
Edition 2019-02-01

Standards [CURRENT]

IPC 4554

Specification for Immersion Tin Plating for Printed Circuit Boards
Edition 2012-01-01

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