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IPC TR-464
Accelerated Aging for Solderability Evaluations
Edition
1984-04
IPC TR-464 Addendum 1
Accelerated Aging for Solderability Evaluations; Addendum
Edition
1987-04
IPC TR-465-1
Round Robin Test on Steam Ager Temperature Control Stability
Edition
1993-01
IPC TR-465-2
Effect of Steam Aging Time and Temperature on Solderability Test Results
Edition
1993-07
IPC TR-465-3
Evaluation of Steam Aging on Alternative Finishes, Phase 11A
Edition
1996-07
IPC TR-476A
Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies
Edition
1984-06
IPC TR-486
Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
Edition
2001-07-17
IPC TR-549
Measles in Printed Wiring Boards
Edition
1973-11
IPC TR-579
Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs
Edition
1988-09
IPC TR-583
An In-Depth Look At Ionic Cleanliness Testing
Edition
2002-07-01
