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Standards [CURRENT]

IPC JEDEC 9707

Spherical Bend Test Method for Characterization of Board Level Interconnects
Edition 2011-09-13

Standards [CURRENT]

IPC JEDEC 9707 AMD 1

Spherical Bend Test Method for Characterization of Board Level Interconnects
Edition 2018-05-01

Standards [CURRENT]

IPC JIEP-0400

Flame Retardant Article Translation
Edition 2000-01-01

Standards [CURRENT]

IPC JIG-101

JIG101ED4: Joint Industry Guide Materials Composition Declaration for Electrotechnical Products
Edition 2011-09-08

Standards [CURRENT]

IPC JPCA-6901

Application Categories for Printed Electronics
Edition 2015-07-01

Standards [CURRENT]

IPC MC-790

Guidelines for Multichip Module Technology Utilization
Edition 1992-08

Standards [CURRENT]

IPC ML-960

Qualification and Performance Specification for Mass Lamination Panels for Multilayer printed Boards
Edition 1994-07-01

Standards [CURRENT]

IPC MS-810

Guidelines for High Volume Microsection
Edition 1993-10

Standards [CURRENT]

IPC NC-349

Computer Numerical Control Formatting for Drillers and Routers
Edition 1985-08

Standards [CURRENT]

IPC OI-645

Standard for Visual Optical Inspection Aids
Edition 1993-10

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