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Standards [CURRENT]

IPC DW-425A

Design and End Product Requirements for Discrete Wiring Boards
Edition 1990-05

Standards [CURRENT]

IPC EIA J-STD-026

Semiconductor Design Standard for Flip Chip Applications
Edition 1999-08-01

Standards [CURRENT]

IPC EIA J-STD-028

Performance Standard for Construction of Flip Chip and Chip Scale Bumps
Edition 1999-08

Standards [CURRENT]

IPC EIA J-STD-032

Performance Standard for Ball Grid Array Balls
Edition 2002-06-30

Standards [CURRENT]

IPC EIA/JEDEC J-STD-002E ; IPC EIA/IPC/JEDEC J-STD-002E:2017-11-01

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
Edition 2017-11-01

Standards [CURRENT]

IPC EIA/JEDEC J-STD-075A ; ECIA/IPC/JEDEC J-STD-075A:2018-05-01

Classification of Passive and Solid State Devices for Assembly Processes
Edition 2018-05-01

Standards [CURRENT]

IPC FA-251

Guidelines for Assembly of Single-Sided and Double-Sided Flex Circuits
Edition 1992-02

Standards [CURRENT]

IPC FC-234A

Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards
Edition 2014-12-23

Standards [CURRENT]

IPC HDBK-001H

Handbook and Guide to Supplement J-STD-001
Edition 2021-01-01

Standards [CURRENT]

IPC HDBK-005

Guide to Solder Paste Assessment
Edition 2006-02-02

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