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IPC 9631
User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation
Edition
2010-12-15
IPC 9641
High Temperature Printed Board Flatness Guideline
Edition
2013-07-10
IPC 9691B
User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
Edition
2016-06-01
IPC 9701B
Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
Edition
2022-02-01
IPC 9706
Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection
Edition
2014-01-14
IPC 9708
Test Methods for Characterization of Printed Board Assembly Pad Cratering
Edition
2010-12-14
IPC 9709
Test Guidelines for Acoustic Emission Measurement during Mechanical Testing
Edition
2013-12-09
IPC 9716
Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies
Edition
2024-12-01
IPC 9797A
Press-fit Standard for Automotive Requirements and other High-Reliability Applications
Edition
2023-05-01
IPC 9850A
Surface Mount Placement Equipment Characterization
Edition
2011-12-21
