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Standards [CURRENT]

IPC 4103B

Specification for Base Materials for High Speed/High Frequency Applications
Edition 2017-11-01

Standards [CURRENT]

IPC 4104

Specification for High Density Interconnect (HDI) and Microvia Materials
Edition 1999-05-09

Standards [CURRENT]

IPC 4110

Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards
Edition 1998-08-01

Standards [CURRENT]

IPC 4121

Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications
Edition 2000-01-01

Standards [CURRENT]

IPC 4130

Specification and Characterization Methods for Nonwoven "E" Glass Mat
Edition 1998-09-01

Standards [CURRENT]

IPC 4202C

Specification for Flexible Base Dielectrics for use in Flexible Printed Boards
Edition 2022-01-01

Standards [CURRENT]

IPC 4203C

Cover and Bonding Material for Flexible Printed Circuitry
Edition 2025-04-01

Standards [CURRENT]

IPC 4204B

Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
Edition 2018-08-01

Standards [CURRENT]

IPC 4411A

Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement
Edition 2003-11-12

Standards [CURRENT]

IPC 4412C

Specification for Finished Fabric Woven from "E" Glass for Printed Boards
Edition 2021-09-01

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