Search results

Search list

Results in:

Products Information Projects & Committees
26,131-26,140 of 352,954 results
  Show
Standards [CURRENT]

DIN EN 62047-10

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011); German version EN 62047-10:2011
Edition 2012-03

Standards [CURRENT]

DIN EN 62047-11

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems (IEC 62047-11:2013); German version EN 62047-11:2013
Edition 2014-04

Standards [CURRENT]

DIN EN 62047-12

Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011); German version EN 62047-12:2011
Edition 2012-06

Standards [CURRENT]

DIN EN 62047-13

Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (IEC 62047-13:2012); German version EN 62047-13:2012
Edition 2012-10

Standards [CURRENT]

DIN EN 62047-14

Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials (IEC 62047-14:2012); German version EN 62047-14:2012
Edition 2012-10

Standards [CURRENT]

DIN EN 62047-16

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods (IEC 62047-16:2015); German version EN 62047-16:2015
Edition 2015-12

Standards [CURRENT]

DIN EN 62047-17

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films (IEC 62047-17:2015); German version EN 62047-17:2015
Edition 2015-12

Standards [CURRENT]

DIN EN 62047-18

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013); German version EN 62047-18:2013
Edition 2014-04

Standards [CURRENT]

DIN EN 62047-19

Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses (IEC 62047-19:2013); German version EN 62047-19:2013
Edition 2014-04

Standards [CURRENT]

DIN EN 62047-20

Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes (IEC 62047-20:2014); German version EN 62047-20:2014
Edition 2015-04

TOP