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Standards [CURRENT]

DIN EN 60169-21

Radio-frequency connectors - Part 21: Two types of radio-frequency connectors with inner diameter of outer conductor 9,5 mm (O,374 in) with different versions of screw coupling - Characteristic impedance 50 Ω (Types SC-A and SC-B) (IEC 60169-21:1985 + A1:1996); German version EN 60169-21:1997
Edition 1998-02

Standards [CURRENT]

DIN EN 60169-23

Radio-frequency connectors; part 23: pin and socket connector for use with 3,5 mm rigid precision coaxial lines with inner diameter of outer conductor 3,5 mm (IEC 60169-23:1991); German version EN 60169-23:1993
Edition 1994-02

Standards [CURRENT]

DIN EN 60169-24

Radio-frequency connectors; part 24: radio-frequency coaxial connectors with screw coupling, typically for use in 75 ohm cable distribution systems (type F) (IEC 60169-24:1991); German version EN 60169-24:1993
Edition 1994-02

Standards [CURRENT]

DIN EN 60169-25

Radio-frequency connectors; part 25: two-pole screw (3/4-20 UNEF) coupled connectors for use with shielded balanced cables having twin inner conductors with inner diameter of outer conductor 13,56 mm (type TWHN) (IEC 60169-25:1992); German version EN 60169-25:1993
Edition 1994-02

Test procedure for the determination of the temperature index of enamelled and tape wrapped winding wires (IEC 60172:2020); German version EN IEC 60172:2021
Edition 2022-04

Standards [CURRENT]

DIN EN 60188

High-pressure mercury vapour lamps - Performance specifications (IEC 60188:2001); German version EN 60188:2001 + A11:2019
Edition 2019-10

Standards [CURRENT]

DIN EN IEC 60191-1

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2018); German version EN IEC 60191-1:2018
Edition 2018-10

Standards [CURRENT]

DIN EN 60191-3

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999
Edition 2000-07

Technical rule [CURRENT]

DIN EN 60191-3 Beiblatt 1

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms
Edition 2006-08

Standards [CURRENT]

DIN EN 60191-4

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018); German version EN 60191-4:2014 + A1:2018
Edition 2019-02

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