• Hydrogen Technologies Standards form the basic framework for market ramp-up

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  • Climate change Standards and specifications support climate targets

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  • Smart Farming Standards and specifications are drivers for the digitalization of agriculture

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Projects of DKE/UK 631.1

IEC 47E/420/CD 2011-09-02 IEC 60747-5-7 Ed.1: Semiconductor devices - Discrete devices - Part 5-7: Photodiodes and phototransistors More  Comment 
IEC 47E/413/NP 2011-06-17 Future IEC 60747-17 Ed. 1.0: Semiconductor devices - Discrete devices - Part 17: Magnetic and capacitive coupler for basic and reinforced isolation More  Comment 
IEC 47E/453/FDIS 2010-07-09 IEC 60747-3 Ed.2: Semiconductor devices - Part 3: Discrete devices: Signal, switching and regulator diodes More  Comment 
IEC 47E/452/FDIS 2008-12-12 IEC 60747-16-5 Ed.1: Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators More  Comment 
IEC 47E/352/NP 2007-10-12 Proposal of the German NC: (Future IEC 60747-x-y): Semiconductor devices - Magnetic and capacitive coupler for safe isolation More  Comment 
IEC 47E/342/NP 2007-09-21 Proposal of the Japanese NC: (Future IEC 60747-16-5): Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators More  Comment 
IEC 47E/328/NP 2007-05-11 (Future IEC 60747-14-x): Semiconductor devices - Discrete devices - Part 14-x: Semiconductor sensors - Test method of CMOS image sensor module More  Comment 
IEC 47E/329/NP 2007-05-11 (Future IEC 60747-14-7): Semiconductor devices - Discrete devices - Part 14-7: Semiconductor sensors - Humidity More  Comment 
IEC 47E/312/NP 2006-09-22 (Future IEC 60747-16-5): Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators More  Comment 
IEC 47E/299/NP 2006-03-31 (Future IEC 60747-14-6): Semiconductor devices - Discrete Devices - Part 14-6: Semiconductor sensors Test method of CMOS imagesensor module More  Comment 

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