Design Guide for High Density Interconnects & Microvias
Edition 2000-11-01

Specification for High Density Interconnect (HDI) and Microvia Materials
Edition 1999-05-09

Space product assurance - Design rules for printed circuit boards; English version EN 16602-70-12:2016
Edition 2016-12

Space product assurance - Qualification and Procurement of printed circuit boards; English version EN 16602-70-60:2019, only on CD-ROM
Edition 2019-10

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) (IEC 91/1973/CDV:2024); German and English version prEN IEC 61189-3-302:2024
Edition 2025-11

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates (IEC 62878-1:2019); German version EN IEC 62878-1:2019
Edition 2021-10

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA (IEC 61189-2-805:2024); German version EN IEC 61189-2-805:2024
Edition 2025-08

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017); German version EN 61191-2:2017
Edition 2018-05

Space product assurance - High-reliability soldering for surface mount, mixed technology and hand-mounted electrical connections; English version EN 16602-70-61:2022
Edition 2023-01