Device embedding assembly technology - Part 1: Generic specification for device embedded substrates (IEC 62878-1:2019); German version EN IEC 62878-1:2019
Edition 2021-10

Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements; controlled impedance (IEC 61188-1-2:1998); German version EN 61188-1-2:1998
Edition 1999-03

Base materials for printed circuits; part 3: special materials; specification No. 3: permanent polymer coating materials (solder-resist) for use in the fabrication of printed boards; identical with IEC 60249-3-3:1991
Edition 1994-06

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1700/CD:2021); Text in German and English
Edition 2022-04

Printed boards - Part 1: Generic specification (IEC 62326-1:2002); German version EN 62326-1:2002
Edition 2002-12

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies (IEC 61189-5:2006); German version EN 61189-5:2006
Edition 2007-05

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2022); German version EN IEC 60749-37:2022
Edition 2023-12

Space product assurance - Qualification and Procurement of printed circuit boards; English version EN 16602-70-60:2019, only on CD-ROM
Edition 2019-10

Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance (IEC 60352-5:2020); German version EN IEC 60352-5:2020
Edition 2022-07

Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering (IEC 61760-3:2021); German version EN IEC 61760-3:2021
Edition 2022-07